Uni-venture Circuits can make 4~32 Layer multilayer PCBs, we mainly focus on the oversea market to service customers for their PCB Prototype, small to medium PCB needs. We are good at impedance control, hard Gold plating, Gold fingers.
Rigid PCBs are available in a wide variety spanning from simple single-sided boards to highly integrated multilayer substrates with blind and buried vias. An even higher degree of integration can be achieved by using the PVA-technology – a combination of copper filled vias with sequential build up also know as stacked vias. It is also possible to realize copper filled vias directly in the pad (via in pad) rendering substantial higher packing densities and better assembly yields.
Additional functionality can be integrated by using edge metallization or high precision depth milling.