Detailed Capabilities

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Detailed Capabilities

  • Competitive, direct offshore price with local customer service and engineering support.
  • Quick turn Prototype (shipping in 5-10 days), Mid Volume (3-4 weeks)
  • 1-32 Layers Rigid, 2-12 layers Rigid/Flex
  • Blind/Buried Vias, Sequential Lamination
  • HDI, Build-up Microvias, Copper Filled / Stacked Microvias
  • Via-in-Pad, Conductive & Non-conductive Via Fill
  • Heavy Copper – UL approved up to 16 oz
  • Metal backed PCBs
  • Special Materials, Hybrid Construction
  • Selective and Multiple Surface Finishes
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