Capabilities
You Are Here: Capabilities
We have big capabilities for SMT/SMD assembly through-hole and mixed technology PCB assemblies. BGA down to 0.25mm pitch, 0201 component placements and leadless devices assembly can also be available. High speed advanced Fuji SMT machines can well support your strict requirements of PCB assembly, whatever in relation to mil spec,network,communication, health care, medical, musical instrument discuss application. In terms of pass rate, we have done 99.9%. Our engineering team will discuss about assembly manufacturing process once we get your order The best work plan will be figured out and your PCBs are performed in quality online.
Full range of PCB manufacturing and assembly services to fit all of your printed circuit board capability needs.
We are a one-stop printed circuit board manufacturer and quick turn PCB assembly solution. Offering some of the most advanced PCB technology and convenient services found in the industry: Full Spec PCBs,Small Quantity – Quick Turn PCBs, Custom Spec – Quick Turn PCBs, Highly Specialized Precision PCBs,Large Scale Production (No order is too small or too large.
Feature | 2017 | |
Standard | Advanced | |
Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave FLEX: IMS: Please contact us for full details regarding material availability |
RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material Ultra Low – Loss material Super Low – Loss material and High Thermal Reliability Laminate FLEX: IMS: Please contact us for full details regarding material availability |
Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC |
0.025mm for PCB 0.012mm for FPC |
Layer count | 1 – 38L / 40L QTA | 64L (pilot runs) |
HDI / Buried – blind via | Y | Y |
Copper filled BVH (Y/N) | Y | Y |
Copper filled PTH (Y/N) | Y | Y – copper paste |
Copper paste filled PTH (Y/N) | Y | Y |
Capped via (Y/N) | Y | Y |
LDI (Y/N) | Y | Y |
Maximum board size (mm) | 1050 x 610 | 1400 x 610 |
Minimum board thickness (mm) 2L |
0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC |
0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC |
Minimum board thickness (mm) ≥4L |
0.25 for PCB 0.20 for FPC |
0.25 for PCB 0.16 for FCP |
Maximum board thickness (mm) | 8.6 | 10.0 |
Minimum track / gap IL (mil)- copper weight dependant | 0.075mm | 0.05mm |
Minimum track / gap OL (mil)- copper weight dependant | 0.075mm | 0.05mm |
Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF |
Layer to layer registration | 0.05mm | 25μm |
Minimum hole (mech) (mm/mil) | 0.15mm | 0.1mm |
Minimum hole (laser) (mm/mil) | 0.075 | 0,05 |
Aspect ratio PTH | 15:1 | 20:1 |
Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependent) |
Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm |
Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 |
Maximum Cu weight OL | 12oz | 12oz |
Maximum Cu weight IL | 12oz | 12oz |
Controlled impedance (+/- X%) | Others ± 10% | ± 5% |
Rigid-flex (Y/N) | Y | Y including semi flex |
Flexible (Y/N) | Y | Y |
IMS (Y/N) | Y (Al) | Y (both Al and Cu) |
Embedded components (Y/N) | Y | Y |
Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y |
Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |
*It is important to note that even with ‘standard’ technology this does not mean we can achieve ALL of the aspects – When using combinations of these parameters; you should always consult our sales.